For controlling texturing and etching processes of solar wafers

• INLINE compact system for your production line or OFFLINE table-top system,
  motorized scanning or manual operation

• Measurement of reflectance ( r ) and color ( c )

• Measures:

1. Spectral reflectance (working distance: 1 mm, angular range: ± 84°)

2. Spatial angle reflectance (working distance: 1 mm – 10 mm, angular range 84°- 42°)

3. Spectral values (lambda range: VIS: 380 – 1050 nm, VIS_ext: 360 – 1050 nm)

4. Color spaces: Lab / Luv / LCH / xyY / XYZ / Yab

5. Layer thicknesses: 5 – 200 nm (material-dependent variation: SiN_x, AlO_x, SiO_x)

• Measuring speed per point: ≤ 100 ms

• Measuring spot size (round): approx. 4 mm

• Working distance to the solar wafer: approx. 1 – 10 mm